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Dialog Improves System Performance
Non-volatile memory (NVM) is a key component at the heart of every system design. It holds critical data, controls how the system boots, and affects overall performance. Choosing the right NVM is key. We’re here to help. Our wide range of NVM products offer an array of features designed to help tune and optimize your system.
Octal xSPI Memory
Hi-Performace
xSPI (8x SPI)
High bandwidth
Low power
eXecute-in-Place (XiP)
Read-While-Write
Security
Dual / Quad SPI Memory
Universal
SPI, Dual, Quad
1.8V, 3.0V. Wide VCC
Ultra-low Energy, Low Power
7nA sleep
Battery monitor
Security
DataFlash SPI Memory
Fast Flexible Robust
Concurrent programming
Easy to use
Power fail protection
Data integrity
Low power modes
Security
Wafer KGD
Known Good Die program
Up to 125°C operating temperature
All voltage levels
- 1.8V
- 3.0V
- Wide Voltage 1.65V to 3.6V
Verified Memory for ST Microelectronics
Dialog SPI Flash solutions verified on over 30 STM32 MCUs
CBRAM Technology
CBRAM is a resistive RAM technology that provides power, speed, and cost benefits over other non-volatile memory technologies. It is well suited for battery powered devices, edge computing, and AI applications.
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7 months ago
AT25PE20‐SSHN‐T Reflow Solder Profile
Posted byAHHoefer25 points 1 replyHello,
Is there a recommended reflow profile specified by Dialog for the AT25PE20‐SSHN‐T? Specifically the time that can be spent at peak temperature and number of reflow cycles the part can withstand.
Thank you.
7 months ago
We use the JEDEC standard profile as specified in J-STD-020D.1 for all of the Flash memory devices.
The max temp must be < 235degC
and for lead free process the time above 217degC should be between 60-150 secs.
I understand that this is a 'standard' profile for small SM components and the device will survive >3 cycles with out any change to datasheet specs.