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Bluetooth low energy

智能债券™:功率、尺寸和系统成本不受影响

蓝牙®低能量是事实上的低功率andard for connecting devices to each other and to the cloud. Highly integrated, the SmartBond™ SoC family features the smallest, most power efficient Bluetooth low energy solutions available and enables the lowest system costs. An extensive suite of support tooling ensures ease of use and a fast route to market.

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Bluetooth Low Energy
SmartBond™ Product Portfolio Download PDF
零件号 DA14699/7/5/1 DA14683型 DA14682型 DA14586型 DA14585型 DA14531/0型 DA14531MOD
Product Description 世界上最先进的无线微控制器产品系列 Single-chip high-security Bluetooth 5 solution with expandable memory Small size, low power and most integrated Bluetooth 5 SoC The world’s smallest and lowest power Bluetooth 5.1 System-on-Chip which enables the next 1billion IoT devices The DA14531 SmartBond TINY™ Module, based on the world’s smallest and lowest power Bluetooth 5.1 system-on-Chip
TYPE
SoC公司
Module
TECHNOLOGY
Bluetooth® LE 5.2 5 5 5 5 5.1 5.1
2.4 GHz proprietary
CORE SYSTEM
CPU 96MHz臂
Cortex-M33
Floating Point DSP Extension
96MHz臂
Cortex-M0
96MHz臂
Cortex-M0
16MHz Arm
Cortex-M0
16MHz Arm
Cortex-M0
16MHz Arm
Cortex-M0+
16MHz Arm
Cortex-M0+
RAM 512kB
三84kB(691)
128kB 128kB 96 KB 96 KB 48kB 48kB
ROM
OTP
128kB
4kB
128kB
64 KB
128kB
64 KB
128kB
64 KB
128kB
64 KB
144kB
三2kB
144kB
三2kB
Flash QSPI Flash QSPI Flash 1024kB 256kB SPI闪存 SPI闪存 128kB
Crystals 三2MHz+32kHz 三2/16MHz+32kHz 三2/16MHz+32kHz 16MHz+32kHz 16MHz+32kHz 三2MHz 三2MHz
权力
内部DCDC 巴克 巴克 巴克 巴克&Boost 巴克&Boost 巴克&Boost 巴克
外部系统电源轨 2x1.8V, 1x3.3V 2x1.8V, 1x3.3V 2x1.8V, 1x3.3V
Charger ● ● ● ○
安全
AES/SHA 256/512 256/512 256/512 128 128 128 128
ECC/TRNG公司 ● ● ● ● ● ● ○ ● ○ ●
Secure Key Handling
RADIO
Frequency 2.4兆赫 2.4兆赫 2.4兆赫 2.4兆赫 2.4兆赫 2.4兆赫 2.4兆赫
Tx Power 6dBm 0dBm 0dBm 0dBm 0dBm 2.5分贝 2.2dBm
Rx Sensitivity -97dBm -94dBm -94dBm -93dBm -93dBm -94dBm -94dBm
PERIPHERALS
UART/SPI/I2C 三/2/2 2/2/2 2/2/2 2/1/1 2/1/1 2/1/1 2/1/1
QSPI XiP公司
On-the-fly decryption
2/2/2/1
1
1
USB FS/HS 1 1 1
Timers/PWM/RTC 4/4/1 3/3 3/3 4/2 4/2 三/2/1 三/2/1
I2S,PCM/PDM 8通道/2通道 8通道/2通道 8通道/2通道 8通道/2通道 8通道/2通道
LCD ● ● ● ○
Keyboard/QDEC/IR ● ● ● ● ● ● ● ● ○ ● ● ○ ● ● ○ ● ● ○
模数转换器 8CH 10b
8CH 14b
8CH 10b 8CH 10b 4CH 10b型 4CH 10b型 4CH 10b型 4CH 10b型
LED driver 22○ ○
Temperature sensor
Other 触觉/运动控制器
雷竞技安卓下载
器具
资产跟踪
Beacons
Consumer Electronics
测向
游戏和AR/VR
工业Automation
Medical and Healthcare
网状网络
PC Peripherals
Smart Home and Building
可穿戴设备
Wireless Ranging (WiRa)
Smart door-locks
物联网传感器
PACKAGES
Type#Pins (#GPIO)
尺寸
VFBGA100(55)
5x5 mm
(699/697)
WLCSP53 (21)
三.41x3.01 mm

AQFN60(37)
AQFN60(31)
6x6毫米
QFN40 (24)
5x5 mm
WLCSP34 (14)
2.40x2.66毫米

QFN40 (25)
WLCSP17(六)
1.7x2.05 mm
(531 only)
模块16(9)
12.5x14.5毫米
Operating Temperature -40 to 85°C -40 to 85°C -40 to 85°C -40 to 85°C -40至85/105°C -40 to 85°C -40 to 85°C
Supply Voltage Range 2.4至4.75V 1.7 to 4.75V 1.7 to 4.75V 0.9至3.3V 0.9至3.3V 1.1 to 3.3V 1.8至3.3V
DEVELOPMENT KITS DA14695专业版
DA14695型USB
DA14683专业版
DA14683型USB
DA14683专业版
DA14683型USB
DA14585型PRO
DA14585型BASIC
DA14585型PRO
DA14585型BASIC
DA14531/0型PRO DA14531 USB DA14531MOD PRO
Partner Modules
零件号 DA14531 BDE-301型 DA14531 Hongjia
HJ-531IMF型
DA14531 Honjia
HJ-131IMH
DA14585型/ AzureWave AW-CU362 DA14585型/ Inventek
ISM14585-L35
DA14585型/ Panasonic / PAN1740A
Product Description BDE-BLEM301是基于Dialog超低功耗DA14531 SoC的高度集成的Bluetooth®5.1低能耗模块 Ultra-small, ultra-low power Bluetooth 5.1 SIP module with the SmartBond DA14531 TINY. 5 x 4.75 x 1.3mm in a LGA25 package Ultra-small, ultra-low power Bluetooth 5.1 SIP module with the SmartBond DA14531 TINY. 4 x 4 x 1.3mm in a LGA17 package DA14585 BLE5.0 SoC,1Mbit SPI闪存,嵌入式天线 DA14585型BLE5.0 SoC, up to 8Mbit SPI Flash on board, optional SkyWorks PA on board for increased TX power 9.0 x 9.5 x 1.8mm, integrated antenna and Pre-Certified, ARM® Cortex®-M0, 96kB SRAM, 64kB OTP
雷竞技安卓下载 信标|遥控器|邻近标签|低功耗传感器|调试/供应|玩具|串口传输|智能家居|智能电表|智能医疗设备 微型医疗应用|信标|智能玩雷竞技安卓下载具|智能锁|遥控器|工业智能设备 微型医疗应用|信标|智能玩雷竞技安卓下载具|智能锁|遥控器|工业智能设备 IoT Applications | Connected Sensors | Connected Medical | Environmental Monitoring | Beacons | Home Automation | Industrial Connectivity over BLE | Point of Sale Applications | Building Infrastructure | Temperature & Environmental Monitoring | Connected Toys 物联网应雷竞技安卓下载用|语音遥控|键盘和鼠标|连接传感器|信标和标签|家庭自动化|连接玩具|消费电器 工业IoT | Connected Sensors | Human Interface Devices | Smart Home/Building | Smart Lighting Systems | Metering | Smart Home Nodes | Beacons | Proximity Tags | Tracker | Remote Controls
Legacy Products
DA14680/1 Not Recommended for New Designs; For Improved Performance – SeeDA14682型/3
DA14580/1/2/3 Not Recommended for New Designs; For Improved Performance – SeeDA14585型/6andDA14530/1

InsulinK

Bluetooth®低能耗通过胰岛素笔剂量跟踪帮助管理糖尿病

Our SmartBond™ DA14531 and DA14585 SoCs offer some unique features that are ideal for connected health products like injectors. For example, they can operate from silver oxide batteries and super-small-capacity batteries with high internal resistance, ensuring very long shelf lives thanks to ultra-low leakage currents and the ability to detect first dose setting while switching from hibernation to active mode.
These capabilities are to the fore in the “InsulinK” insulin dosage tracker from Dnurse. This Bluetooth LE-enabled clip turns an ordinary insulin pen into a connected pen to capture a log of injections and dose information and provide patient feedback for better and more effective insulin consumption.

冷链监测

Cool solution for cold chain monitoring

SmartBond小™DA14531 SoC是理想的处理措施ion for cold chain monitoring. It offers the lowest system cost plus scalable radio power to reduce power consumption to low microwatt levels for extraordinarily long battery lifetimes. Dialog offers various software examples to create, for example, smart labels that beacon their temperature or the lowest-cost direction-finding tags for tracking logistics glows. Ideal applications include vaccine transport and food distribution.

米克罗布斯

米克罗布斯™ TINY Click board™

mikroBUS点击董事会™是一个革命性的原因nd-play way to add new functionality to development boards. Our click board-compatible Bluetooth® Low Energy solution allows you to quickly develop simple standalone Bluetooth LE applications or add a Bluetooth LE data pipe to an MCU. Featuring the globally certified SmartBond DA14531 BLE 5.1 module, the board is pre-programmed and supported by MicroElektronika’s mikroSDK and the easy-to-use SDK from Dialog, plus numerous useful software examples including CodeLess, an AT-Command based solution requiring little or no code development.

每季度,我们都会将产品、软件开发主题、培训、活动等方面的最佳技术信息打包并发送到您的收件箱。雷电竞官网登录

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产品ID 应用 标准 记忆size FLASH (Mb) 内存大小ROM(kB) 记忆size OTP (kB) 内存大小RAM(kB) GPIOs (max) 权力supply min (V) 权力supply max (V) Tx current (mA) Rx current (mA) 输出功率(dBm) Sensitivity (dBm) 微控制器 Recommended for new Designs Package Max system clock (MHz) Flexible system clock Execute from FLASH 硬件加密引擎 QSPI SPI UART I2C USB 产品数据管理 文件
DA14580-01UNA型 信标和接近Health & FitnessHuman Interface DevicesSmart Home BLE 4.2 Core specification 0 84 三2 50 14 0.9 3.6 4.8 5.1 0 -93 M0 No WL-CSP34,2.5*2.5*0.5mm 16 No No Yes 0 1 2 1 0 0 文档
DA14580-01AT2 信标和接近Health & FitnessHuman Interface DevicesSmart Home BLE 4.2 Core specification 0 84 三2 50 24 0.9 3.6 4.8 5.1 0 -93 M0 No QFN40,5*5*0.9毫米 16 No No Yes 0 1 2 1 0 0 文档
DA14580-01A32 信标和接近Health & FitnessHuman Interface DevicesSmart Home BLE 4.2 Core specification 0 84 三2 50 三2 0.9 3.6 4.8 5.1 0 -93 M0 No QFN48,6*6*0.9mm 16 No No Yes 0 1 2 1 0 0 文档
DA14581-00UNA 无线充电主机控制器接口 BLE 4.2 Core specification 0 84 三2 50 14 0.9 3.6 4.8 5.1 0 -93 M0 No WL-CSP34,2.5*2.5*0.5mm 16 No No Yes 0 1 2 1 0 0 文档
DA14581-00000维拉 无线充电主机控制器接口 BLE 4.2 Core specification 0 84 三2 50 14 0.9 3.6 4.8 5.1 0 -93 M0 No WL-CSP34,2.5*2.5*0.3mm 16 No No Yes 0 1 2 1 0 0 文档
DA14581-00AT2型 无线充电主机控制器接口 BLE 4.2 Core specification 0 84 三2 50 24 0.9 3.6 4.8 5.1 0 -93 M0 No QFN40,5*5*0.9毫米 16 No No Yes 0 1 2 1 0 0 文档
DA14583型-01F01AT2 信标和接近Health & FitnessHuman Interface DevicesSmart Home BLE 4.2 Core specification 1 84 三2 50 24 2.35 3.6 4.8 5.1 0 -93 M0 No QFN40,5*5*0.9毫米 16 No No Yes 0 1 2 1 0 0 文档
DA14585型-00000VV2* 信标和接近Health & FitnessHuman Interface DevicesSmart HomeRemote Controls with voice commands over BLE 表5.0 Core specification + supplemental features 0 128 64 96 14 0.9 3.6 4.8 5.1 0 -93 M0 Yes WL-CSP34,2.4*2.66*0.5mm 16 No No Yes 0 1 2 1 0 1 文档
DA14585型-00000AT2* 信标和接近Health & FitnessHuman Interface DevicesSmart HomeRemote Controls with voice commands over BLE 表5.0 Core specification + supplemental features 0 128 64 96 25 0.9 3.6 4.9 5.3 0 -93 M0 Yes QFN40,5*5*0.9毫米 16 No No Yes 0 1 2 1 0 1 文档
DA14586型-00F02AT2* 信标和接近Health & FitnessHuman Interface DevicesSmart HomeRemote Controls with voice commands over BLE 表5.0 Core specification + supplemental features 2 128 64 96 24 1.8 3.6 4.9 5.3 0 -93 M0 Yes QFN40,5*5*0.9毫米 16 No No Yes 0 1 2 1 0 1 文档
DA14680-01F08A92型 可穿戴设备Smart HomeApple HomeKitHuman Interface Devices其他可充电设备 BLE 4.2 Core specification + optional features 8 128 64 128 三1 1.7 4.75 5.2 6 0 -94 M0 No AQFN60,6*6*0.8毫米 96 Yes Yes Yes 0 2 2 2 1 1 文档
DA14681型-01000U2 可穿戴设备Smart HomeApple HomeKitHuman Interface Devices其他可充电设备 BLE 4.2 Core specification + optional features 0 128 64 128 21 1.7 4.75 5.2 6 0 -94 M0 No WL-CSP53,3.4*3.0*0.5毫米 96 Yes Yes Yes 1 2 2 2 1 1 文档
DA14681型-01000A92 可穿戴设备Smart HomeApple HomeKitHuman Interface Devices其他可充电设备 BLE 4.2 Core specification + optional features 0 128 64 128 三7 1.7 4.75 5.2 6 0 -94 M0 No AQFN60,6*6*0.8毫米 96 Yes Yes Yes 1 2 2 2 1 1 文档
DA14682型* 可穿戴设备Smart HomeApple HomeKitBluetooth meshCloud connected applications 表5 8 128 64 128 三1 1.7 4.75 5.2 6 0 -94 M0 Yes AQFN60,6*6*0.8毫米 96 Yes Yes Yes 0 2 2 2 1 1 文档
DA14683型* 工业Human Interface DevicesVirtual reality remotesBanking 表5 0 128 64 128 三7 1.7 4.75 5.2 6 0 -94 M0 Yes AQFN60,6*6*0.8毫米 96 Yes Yes Yes 1 2 2 2 1 1 文档
DA14691-00000 HQ2型* 可穿戴设备Smart HomeApple HomeKitBluetooth meshCloud connected applications 表5.0 Core specification + optional features Optional external 128 4 三84 44 2.4 4.75 3.5 2.2 6 -97 M33 Yes VFBGA86,6 x 6 x 0.55毫米 96 Yes Yes Yes 1 2 2 1 1 文档
DA14695型-00000HQ2* 可穿戴设备Smart HomeApple HomeKitBluetooth meshCloud connected applications 表5.0 Core specification + optional features Optional external 128 4 512 44 2.4 4.75 3.5 2.2 6 -97 M33 Yes VFBGA86,6 x 6 x 0.55毫米 96 Yes Yes Yes 1 2 2 1 1 文档
DA14697-00000HR2* 可穿戴设备Smart HomeApple HomeKitBluetooth meshCloud connected applications 表5.0 Core specification + optional features Optional external 128 4 512 55 2.4 4.75 3.5 2.2 6 -97 M33 Yes VFBGA100, 5 x 5 x 0.475 mm 96 Yes Yes Yes 2 2 2 1 1 文档
DA14699-00000HR2* 可穿戴设备Smart HomeApple HomeKitBluetooth meshCloud connected applications 表5.0 Core specification + optional features Optional external 128 4 512 55 2.4 4.75 3.5 2.2 6 -97 M33 Yes VFBGA100, 5 x 5 x 0.475 mm 96 Yes Yes Yes 2 2 2 1 1 文档
DA14531 DisposablesBeacons资产跟踪Connected health区域协调单位 表5.1 Core specification + supplemental features 0 144 三2 48 12 0.9 3.6 3.5 2.2 0 -94 M0级+ Yes QFN24*2.2*3.04毫米 16 Yes Yes Yes 0 1 2 1 0 0 文档

*推荐用于新设计

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可穿戴设备

Wearable electronics is entering every facet of our daily life, giving us new ways to improve our lives: from productivity to health and lifestyle. Revealing previously unattainable information about ourselves and our surroundings, they help advise us.

SmartBond Solutions:DA14682型/3,DA14585型/6,DA1469x型

Proximity & Asset Tracking

Proximity applications are based on knowing and alerting you of the distance between two devices, such as keys or wallets, if the label goes out of range. Proximity information can also be used in asset tagging for inventory and automated access control or monitoring in cold chain tracking.

SmartBond Solutions:DA1469x型,DA14531

Connected Medical

Connected medical offers solutions in allowing patients to take care of their own health condition in monitoring, sending alerts and making drug delivery easy. Bluetooth low energy is the technology to connect health products to the cloud. Examples of connected medical products are blood pressure meters, heart rate monitors, glucose meters and patches, body temperature meters, virus testers and drug delivery with injectables or via patches through the skin.

SmartBond Solutions:DA14531,DA1469x型

智能家居与建筑

Long dreamt of, the Smart Home is now becoming a reality. We can monitor and control our home security, lighting, appliances and heating, ventilation and air-conditioning (HVAC) from our smartphones and tablets – even remotely via the cloud.

SmartBond Solutions:DA14682型/3,DA14585型/6,DA14531

Computing & Gaming

Bluetooth has played a key role in connecting computing and gaming peripherals since its introduction. It provides a simple and proven connectivity option for a host of new and emerging peripherals, while securing access to the most personal data.

随着电子设备变得越来越智能和移动化,我们与之互动的方式也在改变。我们需要更多的控制、更多的便利和更少的混乱,这正推动着无线HID市场的巨大增长。最新版本的windows默认支持蓝牙低能耗,这真正实现了无线桌面。

SmartBond Solutions:DA14585型/6,DA1469x型

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SmartBond™ SDK Overview 支持的产品
SDK6 DA14585型/6+DA14531/0型
SDK10 DA1469x型
SDK1 DA14682型/3

也可用于DA14680/1,但不建议用于新设计

SDK5 DA14580/1/3

Not recommended for new designs

SmartBond™ Development tools overview 支持的产品
对话框Smartbond Flash Programmer DA14531/0型
SmartSnippets Toolbox All
SmartSnippets工作室 All

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社交distancing

用于社交距离应用的嵌入式软件应用程序雷竞技安卓下载

Read More

Bluetooth Low Energy Range Extender

智能债券™ BLE范围扩展器参考设计使您能够充分利用蓝牙低能量标准的输出功率来扩展应用范围。雷竞技安卓下载

Read more

Smart USB Dongle

The Smart USB Dongle device is a fully integrated USB to Bluetooth® LE solution, based on SmartBond™ DA14683 high-security Bluetooth LE SoC.

Read more

emWin

The emWin embedded graphics library developed by SEGGER Microcontroller is now offered by Dialog Semiconductor in library form for free commercial use with the SmartBond® DA1469x wireless microcontrollers.

Read more

Stay connected

直接通过我们的全球销售办事处与我们联系,或联系我们的全球分销商和代表之一。

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我们的SmartBond产品雷电竞官网登录由开发工具包和配置文件支持,以帮助您创建充分利用SmartBond系列独特优势的应用程序。这些工具可以帮助您尽量缩短上市时间。雷竞技安卓下载

硬件Development Kits

DA14531 DA14531-USB,DA14531 - Pro
DA14585型 DA14585型- Basic,DA14585-专业版
DA14683型 DA14683-USB,DA14683型- Pro
DA14695型 DA14695型– USB,DA14695型- Pro
所有蓝牙产品雷电竞官网登录 Production Line Tool

以应用程序为中心的开发工具包

Discontinued Kits

DA14583型 DA14583型IoT Sensor Development Kit
DA14585物联网是一个升级的传感器开发工具包,具有更多受支持的传感器和云连接
DA14681型 DA14681型家Kit Development Kit
DA14681型 DA14681型Wearable Development Kit

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公司总部位于日本,主要从雷电竞下载app事电子元器件和音响设备的制造和销售。

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Bithium - your partner in the design of innovative wireless embedded systems (firmware, hardware, software). Bithium keeps a clear focus on achieving project targets and customer satisfaction.

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Cambridge Consultants is a premium multidisciplinary supplier of innovative product development engineering and technology consulting. We help clients deliver groundbreaking products to market fast, with cutting-edge technology that often results in new IP generation for our clients.

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Cloud2GND is a global engineering services firm specializing in standards-based wireless connectivity solutions. Our clients range from innovative start-ups to large semiconductor companies and standards organizations. We offer deep domain knowledge in embedded systems, especially around Bluetooth technology, where we provide consulting, design, development, test, deployment and maintenance services for our clients and their customers. Our engineering services division offers a flexible engagement model acting as a specialized team of standards experts or a complete engineering team able to manage your project needs to completion.

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Lauterbach是全球领先的完整、模块化和可升级微处理器开发工具制造商,自1979年以来在嵌入式设计领域拥有丰富经验。工程团队开发和生产高度熟练和专业化的开发工具,这些工具以TRACE32®品牌在世界各地使用。

LitePoint is the leading provider of test solutions for the world's leading manufacturers of wireless

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Murata is a global leader in the design, manufacture and supply of advanced electronic materials, leading edge electronic components, and multi-functional, high-density modules.

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Panasonic Industrial Devices Sales Company of America. Many products sold by Fortune 500 companies are in fact Powered by Panasonic technology, and we are proud to provide manufacturers with the performance, quality, and reliability that are synonymous with the Panasonic brand. The Power of Panasonic Industrial Devices brings strategic innovations to our customers’ product development process.

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TDK是世界上最大的电子元件制造商之一。

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Tieto is the leading product development services company enabling semiconductor, connected device and communication infrastructure manufacturers, build next generation connected devices & things, cars and networks.

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Wireless technology experts. Xtel's core competency is technology development, which makes up a substantial part of its business. It utilizes state-of-the-art technologies to create the next product or technical platform for its partners. Among its clients, it counts some of the world’s leading tech innovators. It is typically tasked with the development of wireless technology, protocols, and ultralow power designs and products. Xtel has in-depth knowledge of the product development and maturation of wireless technologies. It typically uses proven and tested standard components or platforms, helping its partners to reduce time to market. Where a technology boost is needed, it develops complete products or assist a development team in the company. Its technological solutions and innovative skills are recognized by its partners.

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Quuppa is a leading technology provider for real-time locating systems (RTLS) and indoor positioning systems (IPS). The company was established in 2012 by a team of experienced engineers and scientists as a spin-off from Nokia Research Center and has since successfully commercialised its offering, creating a complete product platform: the Quuppa Intelligent Locating System™, a one-size-fits-all technology platform for location-based services and applications. Our platform offers companies a complete software suite of tools for planning, simulating and commissioning projects, that can be used as a solid and scalable foundation for building various location-based solutions. The open API makes it fast and easy to take the platform into use. To date, the Quuppa Ecosystem has more than 200 partners around the world who use Quuppa’s open, versatile and reliable positioning platform to deliver accurate, real-time and cost-effective location solutions to companies in a range of industries, including manufacturing and logistics, retail, healthcare, sports, law enforcement and security, government, asset tracking.

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返回结果
贴子:SDK 10.0.10
Sort by:

三months ago

This is a test question

Posted by test-customer

5 months ago

Test forum

Posted by Anonymous

三weeks ago

SDAC prameters

由piotrekd发布 3个答复

4周前

编译SDAC示例代码时出现问题

由piotrekd发布 4replies

4周前

完成

Linux VM - Using external interface on multiple devices

作者:davidèratayczak 2replies

4周前

完成

微控制器Selection

由sgutala发布 1reply

三weeks ago

SDADC vRef - only 1.2v tolerant?

由KWolfe81发布 5 replies 2upvotes

一周前

Platform_reset_sdk error

Posted by jagath52 1reply

一周前

Launching QSPI_DA1469x debug error

Posted by jagath52 3个答复