DA14586.Delivers Bluetooth 5 Spec Via the Smallest, Most-Flexible, Lowest-Power Chipset to Date

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DA14586.Delivers Bluetooth 5 Spec Via the Smallest, Most-Flexible, Lowest-Power Chipset to Date

由Mark de Clercq,低功耗连接业务部门主任

With the market for Internet of Things (IoT) connectivity continuing to以Breakneck节奏成长,甚至更有效和表演Bluetooth®规范将上网只是一个时间问题。输入蓝牙5,迄今为止的蓝牙技术最快,最有能力的迭代,这是12月初的蓝牙特殊兴趣组(SIG)的新标准连接规范。

这一新规范有望帮助提高IOT设备的创建,这是一个预计会增长的市场细分市场480亿个联系全球到2021年,并提供增强的能力。虽然蓝牙5和蓝牙4.2,前面的SIG标准,在指定方面甚至可能甚至是整个数字,但这两代服务规范之间的差异是剧烈的。

对于初学者来说,蓝牙5是其前身的两倍,并且可以在范围的四倍连接设备,使IOT小工具更容易彼此在更大的距离和墙壁和建筑物中互相通信。蓝牙5也可以处理2 Mbps的蓝牙4.2带宽的两倍,允许具有新标准的设备,以便以最新的速度转移两倍的数据。

蓝牙5在使用广播频道的使用中也更有效率,这已经挤满了蓝牙传输传输的2.4 GHz无线电频段。蓝牙5在广播频道容量中提供800%的增长,这使开发人员能够开发更少的限制性蓝牙的设备。例如,开发人员从开发仅在与特定设备(即智能手机)配对时仅使用的应用程序移动,以基于位置相关信雷竞技安卓下载息的个人导航和其他应用程序的无连接服务。这种新规范甚至可以创建基于体验的应用程序,从而利用虚拟和增强现实。

In tandem with the adoption of Bluetooth 5, we’ve developed our latest SmartBond™ System-on-Chip (SoC), theDA14586., which is the smallest, most flexible and lowest-power chipset as well as being the first qualified Bluetooth 5 standalone SoC. Although new products featuring Bluetooth 5 aren’t expected to hit the market for many months, making our SoC available right on the outset of Bluetooth upgrade allows customers to create advanced use cases that are interoperable with the latest standard’s specification.

This new SoC builds on the benefits of our existingDA14580.SOC,已经在灵活性和功率效率方面引领了该行业。这DA14586.will now enable even more advanced applications from the smallest footprints and power budgets, along with supporting an integrated microphone interface that reduces the system cost of voice-command remote controls. This opens the door to a new era of connected devices and applications, ranging from the proliferation of voice-controlled devices to sensors, beacons and wearables that can seamlessly connect and communicate with each other.