Small size is critical for many IoT applications. SiP (System in Package) allows IoT device makers to reduce the size of their electronic circuit hence achieving a small form factor for their end products. Dialog’s partner Tangshan HongJia Electronic Technology Co., Ltd. has developed an ultra-small, ultra-low power Wi-Fi SIP module with Dialog’s DA16200, the world’s most power-efficient Wi-Fi SoC. The HJ-DA16200 delivers the same long battery life and low power consumption offered by DA16200 module but in a much smaller form factor.